ICT Fixture Debugging & Optimization (Keysight 3070)

Systematically debugged complex in-circuit test failures affecting production yield in our Agilent 3070 series 3. Analyzed fixture design, contact reliability, and test program logic. Led a targeted engineering effort to identify root causes of intermittent ICT failures across multiple PCB assemblies. Performed structured failure analysis covering mechanical fixtures, probe contact reliability, and test program logic. Implemented corrective actions in fixture design, probe selection and alignment, and test sequence optimization to eliminate spurious failures and stabilize production test yields.

Key Responsibilities and Activities - Fixture and Probe Assessment — Inspected mechanical fixtures and PoGo‑pin arrays for wear, alignment drift, and contact resistance; measured contact force and continuity under production conditions. - Test Program Debugging — Reviewed ICT vectors and timing; isolated false‑positive signatures caused by debounce, timing margins, and incorrect net mappings. - Root Cause Verification — Designed controlled experiments and A/B tests on the production line to validate fixes and quantify improvements. - Process Changes — Recommended probe types and spring forces, and updated test program logic and thresholds. By rewriting the test algorithm in BT-Basic, I achieved a stable and reliable test process.